Surface Mount Device Package Types

Bumpered quad flat pack cabga ssbga.

Surface mount device package types.

It is larger than the sot 23 and it measures 6 7 mm x 3 7 mm x 1 8 mm. There is a wide range of smd component packages available on the market and come in many shapes and sizes a selection can be seen below. A very large number of different types of package exist. A surface mount package is favored where a low profile package is required or the space available to mount the package is limited.

The small outline integrated circuit soic plastic package is shown above. Concurrently as the device complexity increases the heat generated by operation. Bump chip carrier bga. As electronic devices become more complex and available space is reduced the desirability of a surface mount package increases.

Ceramic land grid array see lga cpga. Surface mount device package types. Surface mount device package types soic package. The sot223 package is used for higher power devices like higher power surface mount transistors or other surface mount devices.

Ceramic ball grid array cfp. Sot 223 small outline transistor. Chip array small scale ball grid array cbga. Ceramic pin grid array cpga graphic cqfp.

Ceramic flat pack clga. A dip can either be a surface mount or through hole device and refers to the location of the leads on either side of the devices case.